期刊
ACS APPLIED MATERIALS & INTERFACES
卷 -, 期 -, 页码 -出版社
AMER CHEMICAL SOC
DOI: 10.1021/acsami.2c05544
关键词
melamine foam; Ti3C2Tx MXene; electromagnetic interference shielding; infrared stealth; percolation threshold; oxidation-resistant
资金
- National Natural Science Foundation of China [51872002, 52172174]
- Open Project of Provincial and Ministerial Scientific Research Platform, Fuyang Normal University [FSKFKT009D]
- Joint Laboratory of Electromagnetic Material Structure Design and Advanced Stealth Technology
In this study, a multifunctional melamine foam consisting of MXene/polydimethylsiloxane layers was designed through electrostatic self-assembly and impregnation strategies, demonstrating excellent EMI shielding efficiency and infrared stealth capability.
To effectively avoid the drawbacks of conventional metal-based electromagnetic interference (EMI) shielding materials such as high density and susceptibility to corrosion, a multifunctional melamine foam (MF) consisting of MXene/polydimethylsiloxane (PDMS) layers with ultralow percolation thresholds was designed through the electrostatic self-assembly and impregnation strategies. The prepared lightweight foams simultaneously show multifunctional properties including EMI shielding, infrared (IR) stealth, oxidation-resistance, and compression stability. Typically, this multifunctional foam exhibits an excellent EMI shielding efficiency (EMI SE) of 45.2 dB at X-band (8.2-12.4 GHz) with only 1.131 vol % MXene filler. Moreover, the temperature difference between the upper and lower surfaces of the foam can be maintained at 45 degrees C due to its unique three-dimensional (3D) porous structure and low infrared emissivity. The MF skeleton with MXene/PDMS (MFMXP) displays high hydrophobicity, which remains stable in EMI SE after 60 days of exposure to air. Additionally, it shows outstanding mechanical stability after 100 cycles of compression experiments. The lightweight stealth nanocomposite foams can operate stably in complex environments and show high potential for applications in high-tech fields such as wearable electronics, the military, and semiconductors, etc.
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