相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Investigation of microstructure and wetting behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with additions of 1.0 wt % SiC on copper substrate
Manoj Kumar Pal et al.
INTERMETALLICS (2021)
Atmospheric pressure plasma jet fabricating of porous silver electrocatalyst as a promising approach to the creation of cathode layers of low temperature solid oxide fuel cells
Yu-Lin Kuo et al.
SURFACE & COATINGS TECHNOLOGY (2021)
Investigating the atmospheric pressure plasma jet modification of a photo-crosslinkable hydrogel
Ines Hamouda et al.
POLYMER (2020)
Cu6Sn5 intermetallic: Reconciling composition and crystal structure
A. Leineweber et al.
SCRIPTA MATERIALIA (2020)
Simultaneous determination of surface energy and roughness of dense membranes by a modified contact angle method
Bingjun Han et al.
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS (2019)
Contact angle and free surface energy of CdS films on polystyrene substrate
Aleksei N. Kolodin et al.
APPLIED SURFACE SCIENCE (2019)
Influence of water addition on the modification of polyethylene surface by nitrogen atmospheric pressure plasma jet
X. Liu et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2019)
The enhanced abrasion resistance of an anti-fingerprint coating on chrome-plated brass substrate by integrating sputtering and atmospheric pressure plasma jet technologies
Chi-Liang Ko et al.
APPLIED SURFACE SCIENCE (2018)
Tailoring the O-2 reduction activity on hydrangea-like La0.5Sr0.5MnO3 cathode film fabricated via atmospheric pressure plasma jet process
Yu-Lin Kuo et al.
CERAMICS INTERNATIONAL (2018)
Oxygen vacancy levels on gadolinia-doped ceria interlayer deposited by atmospheric pressure plasma jet for solid oxide fuel cells
Yu-Lin Kuo et al.
CERAMICS INTERNATIONAL (2018)
Non-equilibrium atmospheric pressure plasma as innovative method to crosslink and enhance mucoadhesion of econazole-loaded gelatin films for buccal drug delivery
Luisa S. Dolci et al.
COLLOIDS AND SURFACES B-BIOINTERFACES (2018)
Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging
Yongqiang Wan et al.
MICROELECTRONIC ENGINEERING (2018)
Electromigration Effect on Kinetics of Cu-Sn Intermetallic Compound Growth in Lead-Free Solder Joint
Z. W. Fu et al.
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (2017)
Advanced analysis of copper X-ray photoelectron spectra
Mark C. Biesinger
SURFACE AND INTERFACE ANALYSIS (2017)
Carbon-free SiOx ultrathin film using atmospheric pressure plasma jet for enhancing the corrosion resistance of magnesium alloys
Yu-Lin Kuo et al.
VACUUM (2017)
Improving wettability of photo-resistive film surface with plasma surface modification for coplanar copper pillar plating of IC substrates
Jing Xiang et al.
APPLIED SURFACE SCIENCE (2017)
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
N. Zhao et al.
SCIENTIFIC REPORTS (2015)
Enhanced growth of the Cu6Sn5 phase in the Sn/Ag/Cu and Sn/Cu multilayers subjected to applied strain
Chi-Pu Lin et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2014)
Investigation of reactive species using various gas plasmas
Toshihiro Takamatsu et al.
RSC ADVANCES (2014)
Correlation between microstructure evolution and mechanical strength in the Sn-3.0Ag-0.5Cu/ENEPIG solder joint
Chien-Fu Tseng et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2013)
Low-pressure water vapour plasma treatment of surfaces for biomolecules decontamination
F. Fumagalli et al.
JOURNAL OF PHYSICS D-APPLIED PHYSICS (2012)
Oxidation kinetics of thin copper films and wetting behaviour of copper and Organic Solderability Preservatives (OSP) with lead-free solder
Mauricio Ramirez et al.
APPLIED SURFACE SCIENCE (2011)
Atmospheric pressure plasma jet in Ar and Ar/H2O mixtures: Optical emission spectroscopy and temperature measurements
Abdollah Sarani et al.
PHYSICS OF PLASMAS (2010)
Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering
G. Takyi et al.
SOLDERING & SURFACE MOUNT TECHNOLOGY (2010)
Improvement of flux-less, lead-free solder wettability on CF4-plasma-fluorinated Sn and Ag substrates using 'atmospheric pressure non-equilibrium plasma'
Masato Ueshima et al.
SURFACE & COATINGS TECHNOLOGY (2010)
Contact angle analysis of low-temperature cyclonic atmospheric pressure plasma modified polyethylene terephthalate
Chun Huang et al.
THIN SOLID FILMS (2010)
Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating
Pradeep Dixit et al.
APPLIED SURFACE SCIENCE (2007)
Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C
Jeong-Won Yoon et al.
JOURNAL OF MATERIALS RESEARCH (2006)
Water-vapor plasma-based surface activation for trichlorosilane modification of PMMA
TM Long et al.
LANGMUIR (2006)
Atmospheric pressure plasmas: A review
C Tendero et al.
SPECTROCHIMICA ACTA PART B-ATOMIC SPECTROSCOPY (2006)
Plasma and ion sources in large area coating: A review
A Anders
SURFACE & COATINGS TECHNOLOGY (2005)
Effect of plasma cleaning on fluxless plasma soldering of Pb-free solder balls on Si-wafer
JK Moon et al.
MATERIALS TRANSACTIONS (2004)
Study of package warp behavior for high-performance flip-chip BGA
Y Sawada et al.
MICROELECTRONICS RELIABILITY (2003)
Flux-free direct chip attachment of solder-bump flip chip by Ar+H2 plasma treatment
SM Hong et al.
JOURNAL OF ELECTRONIC MATERIALS (2002)
Plasma treatment for fluxless soldering
R Deltschew et al.
SURFACE & COATINGS TECHNOLOGY (2001)
A knowledge-base for electronics soldering
SM Darwish et al.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY (2000)
分享论文
