Evolution in Lithography Techniques: Microlithography to Nanolithography

In this era, electronic devices such as mobile phones, computers, laptops, sensors, and many more have become a necessity in healthcare, for a pleasant lifestyle, and for carrying out tasks quickly and easily. Different types of temperature sensors, biosensors, photosensors, etc., have been developed to meet the necessities of people. All these devices have chips inside them fabricated using diodes, transistors, logic gates, and ICs. The patterning of the substrate which is used for the further development of these devices is done with the help of a technique known as lithography. In the present work, we have carried out a review on different types of lithographic techniques such as optical lithography, extreme ultraviolet lithography, electron beam lithography, X-ray lithography, and ion beam lithography. The evolution of these techniques with time and their application in device fabrication are discussed. The different exposure tools developed in the past decade to enhance the resolution of these devices are also discussed. Chemically amplified and non-chemically amplified resists with their bonding and thickness are discussed. Mask and maskless lithography techniques are discussed along with their merits and demerits. Device fabrication at micro and nano scale has been discussed. Advancements that can be made to improve the performance of these techniques are also suggested.

Automated summary

In today's society, electronic devices have become indispensable for healthcare, lifestyle, and efficient task completion. Various types of sensors have been developed to meet people's needs. These devices all contain chips fabricated using diodes, transistors, logic gates, and integrated circuits. The patterning of the substrate for further device development is achieved through lithography. This study provides a review of different lithographic techniques and examines their evolution and application in device fabrication. The advancements made in exposure tools to enhance device resolution are also discussed. Chemically amplified and non-chemically amplified resists, as well as their bonding and thickness, are examined. Mask and maskless lithography techniques, along with their advantages and disadvantages, are explored. The fabrication of devices at both micro and nano scales is addressed. Suggestions for improving the performance of these techniques are also provided.