Wideband Substrate Integrated Waveguide Chip Filter Using Spoof Surface Plasmon Polariton

This article presents a novel wideband bandpass filter based on the integration of a substrate integrated waveguide (SIW) and a spoof surface plasmon polariton (SSPP). An SIW cavity with periodic arrays of meander-slot units is etched on the top metallic layer to achieve the characteristics of a multi-order filter with good performance. The passbands can be flexibly selected by varying the geometric parameters of the SIW and SSPP to adjust the lower and upper sidebands independently. Using a redistribution layer (RDL) process, a novel 3D capacitive interconnection called a through-dielectric capacitor (TDC) is proposed and collaboratively designed with an interdigital capacitor to achieve capacitive source-load cross-coupling. The proposed filter has a center frequency of 60 GHz, with a wide 3-dB fractional bandwidth of about 45.8%. The improved simulated sideband suppression has a 30 dB rejection at 40 GHz and 75.4 GHz, corresponding to a 30-dB rectangular coefficient of 1.28.

Automated summary

This article presents a novel wideband bandpass filter based on the integration of a substrate integrated waveguide (SIW) and a spoof surface plasmon polariton (SSPP). The proposed filter has flexible passband selection capability and good performance. Additionally, a redistribution layer process is used to propose a novel 3D capacitive interconnection for achieving cross-coupling.