期刊
POLYMERS
卷 14, 期 16, 页码 -出版社
MDPI
DOI: 10.3390/polym14163316
关键词
thermal management applications; nanocomposite aerogels; thermal conductivity; boron nitride; polyvinyl alcohol
In this study, high-performance three-dimensional PVA/aligned BN aerogel framework nanocomposites were fabricated using a facile strategy. The BN platelets were well dispersed and oriented in one direction in the PVA matrix, resulting in high thermal conductivity, good wettability, and high electrical resistivity of the composite materials.
In this study, three-dimensional (3D) polyvinyl alcohol (PVA)/aligned boron nitride (BN) aerogel framework nanocomposites with high performance were fabricated by a facile strategy. The boron nitride powder was initially hydrolyzed and dispersed with a chemically crosslinked plasticizer, diethyl glycol (DEG), in the PVA polymer system. The boron nitride and DEG /PVA suspensions were then mixed well with different stoichiometric ratios to attain BN/PVA nanocomposites. Scanning electron microscopy revealed that BN platelets were well dispersed and successfully aligned/oriented in one direction in the PVA matrix by using a vacuum-assisted filtration technique. The formed BN/PVA aerogel cake composite showed excellent in-plane and out-of-plane thermal conductivities of 0.76 W/mK and 0.61 W/mK with a ratio of BN/PVA of (2:1) in comparison with 0.15 W/mK for the pure PVA matrix. These high thermal conductivities of BN aerogel could be attributed to the unidirectional orientation of boron nitride nanoplatelets with the post-two days vacuum drying of the specimens at elevated temperatures. This aerogel composite is unique of its kind and displayed such high thermal conductivity of the BN/PVA framework without impregnation by any external polymer. Moreover, the composites also presented good wettability results with water and displayed high electrical resistivity of similar to 10(14) Omega cm. These nanocomposites thus, with such exceptional characteristics, have a wide range of potential uses in packaging and electronics for thermal management applications.
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