期刊
POLYMERS
卷 14, 期 14, 页码 -出版社
MDPI
DOI: 10.3390/polym14142950
关键词
electronic encapsulation packaging; underfill material; hybrid filler; aluminum nitride; boron nitride; viscosity; thermal conductivity
资金
- Ministry of Science and Technology [MOST 110-2622-E-011-028, MOST 111-2628-E-011-009-MY3, MOST 111-2622-8-011-009-TE2]
In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were investigated. The results showed that the composite exhibited a 46-fold increase in thermal conductivity with the 75 wt% loading of the AlN-BN hybrid filler, along with higher thermal stability and lower coefficient of thermal expansion compared to pure epoxy.
In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN-BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN-BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/degrees C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.
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