Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing

In this research, the effects of fumed silica (FS) on the Ultraviolet (UV)-ink rheological behavior and processing windows were discussed. Objects using different concentrations of FS inks were printed by the modified UV-Direct ink writing (DIW) printer. The function of fumed silica in the ink-based system has been verified, and the processing scope has been expended with a suitable amount of FS combined with the UV light. The results show that the combination of a suitable amount of FS with the UV-DIW system reaches fast and accurate printing with a larger processing window compared to the non-UV system. However, an excessively high concentration of FS will increase the yield stress of the ink, which also increases the requirement of extrusion unit and the die-swelling effects.

Automated summary

This research discussed the effects of fumed silica on the rheological behavior and processing windows of UV ink. It was found that a suitable amount of fumed silica can improve the printing speed and accuracy by enhancing the ink's rheological behavior and expanding the processing window. However, an excessively high concentration of fumed silica will increase the ink's viscosity and the requirements for equipment.