相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint
WeiMin Xiao et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading
Taehoon You et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Glass-formation and hardness of Cu-Y alloys
Marta Satta et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Predicting the Drop Performance of Solder Joints by Evaluating the Elastic Strain Energy from High-Speed Ball Pull Tests
Taehoon You et al.
JOURNAL OF ELECTRONIC MATERIALS (2009)
Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments
Zhang Liang et al.
JOURNAL OF RARE EARTHS (2009)
Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C
Pei Yao et al.
MICROELECTRONIC ENGINEERING (2009)
Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints
Jeong-Won Yoon et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2008)
Effects of rare earth elements on the microstructure and mechanical properties of NiAl-based eutectic alloy
J. T. Guo et al.
INTERMETALLICS (2007)
Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-PUBM
DG Kim et al.
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY (2005)
Fracture toughness of polycrystalline YCu, DyCu, and YAg
Z Zhang et al.
INTERMETALLICS (2005)
Properties of lead-free solder alloys with rare earth element additions
CML Wu et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2004)
Mechanical strength of Sn-3.5Ag-based solders and related bondings
CM Chuang et al.
JOURNAL OF ELECTRONIC MATERIALS (2004)
Influence of interfacial intermetallic compound on fracture behavior of solder joints
HT Lee et al.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING (2003)
A family of ductile intermetallic compounds
K Gschneidner et al.
NATURE MATERIALS (2003)
Properties of lead-free solder SnAgCu containing minute amounts of rare earth
ZG Chen et al.
JOURNAL OF ELECTRONIC MATERIALS (2003)
Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy
L Wang et al.
MATERIALS LETTERS (2002)