相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
Mohd Izrul Izwan Ramli et al.
MATERIALS (2022)
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow
Nur Syahirah Mohamad Zaimi et al.
MATERIALS (2022)
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps
Chen-Wei Kao et al.
MATERIALS (2022)
Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times
Shiliang Gong et al.
MICROELECTRONICS RELIABILITY (2021)
IMC microstructure modification and mechanical reinforcement of Sn-Ag-Cu/Cu microelectronic joints through an advanced surface finish technique
C. E. Ho et al.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2021)
In-situ observation of fluxless soldering of Sn-3.0Ag-0.5Cu/Cu under a formic acid atmosphere
Siliang He et al.
MATERIALS CHEMISTRY AND PHYSICS (2020)
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints
A. M. Gusak et al.
SCRIPTA MATERIALIA (2020)
Impurity evaporation and void formation in Sn/Cu solder joints
Hsuan-Ling Hsu et al.
MATERIALS CHEMISTRY AND PHYSICS (2019)
Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder
Huigai Wang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2019)
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Yu-An Shen et al.
MATERIALS & DESIGN (2019)
Full intermetallic joints for chip stacking by using thermal gradient bonding
T. L. Yang et al.
ACTA MATERIALIA (2016)
Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate
Xiaowu Hu et al.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2016)
Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering
Ming Yang et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2016)
Effects of Cu Electroplating Formulas on the Interfacial Microstructures of Sn/Cu Joints
Tai-Yi Yu et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2016)
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
Hsi-Kuei Cheng et al.
JOURNAL OF ALLOYS AND COMPOUNDS (2015)
Effect of Pd(P) thickness on the soldering reaction between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad
C. E. Ho et al.
THIN SOLID FILMS (2015)
The Cu-Sn phase diagram, Part I: New experimental results
S. Fuertauer et al.
INTERMETALLICS (2013)
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
Tao-Chi Liu et al.
SCRIPTA MATERIALIA (2013)
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
J. F. Li et al.
ACTA MATERIALIA (2011)
Retarding the Cu5Zn8 phase fracture at the Sn-9 wt.% Zn/Cu interface
Jin-Yi Wang et al.
SCRIPTA MATERIALIA (2011)
Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material
Chia-Ju Chen et al.
JOURNAL OF ELECTRONIC MATERIALS (2010)
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
T. Laurila et al.
MATERIALS SCIENCE & ENGINEERING R-REPORTS (2010)
Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag Solder/Cu joints
X Deng et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2005)
Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints
X Deng et al.
JOURNAL OF ELECTRONIC MATERIALS (2003)
分享论文
