相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Studies of the solidification characteristics in Sn-Ag-Cu-Bi solder alloys.
Ayodele Olofinjana et al.
DIGITAL MANUFACTURING TRANSFORMING INDUSTRY TOWARDS SUSTAINABLE GROWTH (2019)
The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys
Jose Eduardo Spinelli et al.
MATERIALS CHARACTERIZATION (2014)
Influence of indium addition on structure, mechanical, thermal and electrical properties of tin-antimony based metallic alloys quenched from melt
Ria Mostafa Shalaby
JOURNAL OF ALLOYS AND COMPOUNDS (2009)
Substrate dissolution and shear properties of the joints between Bi-Ag alloys and Cu substrates for high-temperature soldering applications
Jenn-Ming Song et al.
JOURNAL OF ELECTRONIC MATERIALS (2007)
Thermal and tensile properties of Bi-Ag alloys
Jenn-Ming Song et al.
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE (2007)
Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates
JM Song et al.
JOURNAL OF ELECTRONIC MATERIALS (2006)
High melting Pb-free solder alloys for die-attach applications
M Rettenmayr et al.
ADVANCED ENGINEERING MATERIALS (2005)
Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy
T El-Ashram et al.
JOURNAL OF ELECTRONIC MATERIALS (2005)
Thermodynamics-aided alloy design and evaluation of Pb-free solders fdr high-temperature applications
JH Kim et al.
MATERIALS TRANSACTIONS (2002)
分享论文
