4.6 Article

Recent Progress in the Topologies of the Surface Acoustic Wave Sensors and the Corresponding Electronic Processing Circuits

期刊

SENSORS
卷 22, 期 13, 页码 -

出版社

MDPI
DOI: 10.3390/s22134917

关键词

surface acoustic waves (SAWs); SAW sensors; interdigital (IDT) electrodes; sensor processing circuits

资金

  1. Bulgarian National Science Fund under the program ERA.NET RUS PLUS [KP-06-DO2/2]
  2. European Regional Development Fund within the Operational Programme Science and Education for Smart Growth 2014-2020 under the Project CoE National center of mechatronics and clean technologies [BG05M2OP001-1.001-0008]

向作者/读者索取更多资源

This paper provides an overview of the latest achievements in surface acoustic wave (SAW) sensors for gas or liquid fluid, focusing on the topology of electrodes and signal processing relevant to sensing device application. The organization of interdigital (IDT) electrodes is essential in determining the acoustic wave distribution mode and improving SAW performance. The signal conditioning system plays a practical role in the implementation of compact and mobile SAW systems. The precision of SAW platform detection is influenced by both the geometry and location of IDT electrodes around the sensing layer.
In this paper, we present an overview of the latest achievements in surface acoustic wave (SAW) sensors for gas or liquid fluid, with a focus on the electrodes' topology and signal processing, as related to the application of the sensing device. Although the progress in this field is mainly due to advances in the materials science and the sensing coatings, the interdigital (IDT) electrodes' organization is also an important tool for setting the acoustic-wave-distribution mode, and, thus, for improvement of the SAW performance. The signal-conditioning system is of practical interest, as the implementation of the SAW, as a compact and mobile system is dependent on this electronic circuit. The precision of the detection of the SAW platform is related not only to the IDT electrodes' geometry but also to their location around the sensing layer. The most commonly used architectures are shown in the present paper. Finally, we identify the needs for the future improvement of these prospective sensors.

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