3D in-plane integrated micro reflectors enhancing signal capture in lab on a chip applications

The integration of micro-optics in lab on a chip (LOCs) devices is crucial both for increasing the solid angle of acquisition and reducing the optical losses, aiming at improving the signal-to-noise ratio (SNR). In this work, we present the thriving combination of femtosecond laser irradiation followed by chemical etching (FLICE) technique with CO2 laser polishing and inkjet printing to fabricate in-plane, 3D off-axis reflectors, featuring ultra-high optical quality (RMS similar to 3 nm), fully integrated on fused silica substrates. Such micro-optic elements can be used both in the excitation path, focusing an incoming beam in 3D, and in the acquisition branch, harvesting the optical signal coming from a specific point in space. The flexibility of the manufacturing process allows the realization of micro-optics with several sizes, shapes and their integration with photonic circuits and microfluidic networks. (C) 2022 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement

Automated summary

This work presents a successful combination of femtosecond laser irradiation, CO2 laser polishing, and inkjet printing to fabricate high-quality micro-optic elements. These elements are fully integrated on fused silica substrates and can enhance the optical performance of lab on a chip devices.