相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。A synergetic strategy of well dispersing hydrophilic Ti3C2Tx MXene into hydrophobic polybenzoxazine composites for improved comprehensive performances
Jingkai Liu et al.
COMPOSITES SCIENCE AND TECHNOLOGY (2022)
Melt Processable Novolac Cyanate Ester/Biphenyl Epoxy Copolymer Series with Ultrahigh Glass-Transition Temperature
Jiaxiong Li et al.
ACS APPLIED MATERIALS & INTERFACES (2021)
Advancements in energy efficient GaN power devices and power modules for electric vehicle applications: a review
Ravindranath Tagore Yadlapalli et al.
INTERNATIONAL JOURNAL OF ENERGY RESEARCH (2021)
Progress on Polymer Composites With Low Dielectric Constant and Low Dielectric Loss for High-Frequency Signal Transmission
Lu Wang et al.
FRONTIERS IN MATERIALS (2021)
High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package
Adwait Inamdar et al.
POLYMER DEGRADATION AND STABILITY (2021)
Effect of acetylacetone metal salts on curing mechanism and thermal stability of polybenzoxazine
Hongqiang Yan et al.
HIGH PERFORMANCE POLYMERS (2020)
Systematic evaluation of cyanate ester/epoxidized cresol novolac copolymer resin system for high temperature power electronic packaging applications
Jiaxiong Li et al.
POLYMER (2020)
Recent advances in polymer-based electronic packaging materials
Yan-Jun Wan et al.
COMPOSITES COMMUNICATIONS (2020)
Engineering Benzoxazine/Epoxy/Imidazole Blends with Controllable Microphase Structures for Toughness Improvement
Jun Yue et al.
ACS APPLIED POLYMER MATERIALS (2020)
Epoxy/triazine copolymer resin system for high temperature encapsulant applications
Jiaxiong Li et al.
2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2019)
Design and Preparation of Benzoxazine Resin with High-Frequency Low Dielectric Constants and Ultralow Dielectric Losses
Jiangbing Chen et al.
ACS APPLIED POLYMER MATERIALS (2019)
Curing behavior and properties of benzoxazine-co-self-promoted phthalonitrile polymers
Dan Lv et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2018)
A review on thermomechanical properties of polymers and fibers reinforced polymer composites
N. Saba et al.
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY (2018)
Controlled synthesis and evaluation of cyanate ester/epoxy copolymer system for high temperature molding compounds
Fan Wu et al.
JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY (2018)
Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices
Fabrizio Roccaforte et al.
MICROELECTRONIC ENGINEERING (2018)
Copolymerization of mono and difunctional benzoxazine monomers with bio-based phthalonitrile monomer: Curing behaviour, thermal, and mechanical properties
Abdul Qadeer Dayo et al.
REACTIVE & FUNCTIONAL POLYMERS (2018)
Review of Silicon Carbide Power Devices and Their Applications
Xu She et al.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS (2017)
Improving the mechanical, thermal, dielectric and flame retardancy properties of cyanate ester with the encapsulated epoxy resin-penetrated aligned carbon nanotube bundle
Qingbao Guan et al.
COMPOSITES PART B-ENGINEERING (2017)
Influence of Thermo-Oxidative Ageing on the Thermal and Dynamical Mechanical Properties of Long Glass Fibre-Reinforced Poly(Butylene Terephthalate) Composites Filled with DOPO
Daohai Zhang et al.
MATERIALS (2017)
Survey of High-Temperature Reliability of Power Electronics Packaging Components
R. Khazaka et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2015)
Study on the thermal degradation behavior of sulfone-containing polybenzoxazines via Py-GC-MS
Huachuan Zhang et al.
POLYMER DEGRADATION AND STABILITY (2015)
Thermal aging of an anhydride-cured epoxy resin
Yongming Yang et al.
POLYMER DEGRADATION AND STABILITY (2015)
Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging
Yiying Yao et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2015)
Electronic materials with a wide band gap: recent developments
Detlef Klimm
IUCRJ (2014)
The effect of curing cycles on curing reactions and properties of a ternary system based on benzoxazine, epoxy resin, and imidazole
Hongyuan Wang et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2013)
The effect of ozone and high temperature on polymer degradation in polymer core composite conductors
James Middleton et al.
POLYMER DEGRADATION AND STABILITY (2013)
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
Mark D. Placette et al.
MICROELECTRONICS RELIABILITY (2012)
Development of flame retardant phosphorus- and silicon-containing polybenzoxazines
M. Sponton et al.
POLYMER DEGRADATION AND STABILITY (2009)
Phthalonitrile-epoxy blends: Cure behavior and copolymer properties
Dawn D. Dominguez et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2008)
Polybenzoxazines - New high performance thermosetting resins: Synthesis and properties
N. N. Ghosh et al.
PROGRESS IN POLYMER SCIENCE (2007)
Thermal analysis and mechanical characterization of maleimide-functionalized benzoxazine/epoxy copolymers
Hatsuo Ishida et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2006)
Effect of the epoxy molecular weight on the properties of a cyanate ester/epoxy resin system
Guozheng Liang et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2006)
Thermal decomposition, combustion and flame-retardancy of epoxy resins - a review of the recent literature
SV Levchik et al.
POLYMER INTERNATIONAL (2004)
Enhancement of processability of cyanate ester resin via copolymerization with epoxy resin
GZ Liang et al.
JOURNAL OF APPLIED POLYMER SCIENCE (2002)
High-temperature electronics - A role for wide bandgap semiconductors?
PG Neudeck et al.
PROCEEDINGS OF THE IEEE (2002)
A study on hydrogen-bonded network structure of polybenzoxazines
HD Kim et al.
JOURNAL OF PHYSICAL CHEMISTRY A (2002)
Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials
S Rimdusit et al.
RHEOLOGICA ACTA (2002)
Investigation of an N•••H hydrogen bond in a solid benzoxazine dimer by 1H-15N NMR correlation techniques under fast magic-angle spinning
GR Goward et al.
MAGNETIC RESONANCE IN CHEMISTRY (2001)
Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins
S Rimdusit et al.
POLYMER (2000)