4.2 Article

Thermoelectric Performance of Sn and Bi Double-Doped Permingeatite

期刊

KOREAN JOURNAL OF METALS AND MATERIALS
卷 60, 期 8, 页码 593-600

出版社

KOREAN INST METALS MATERIALS
DOI: 10.3365/KJMM.2022.60.8.593

关键词

thermoelectric; permingeatite; mechanical alloying; hot pressing; double doping

资金

  1. Basic Science Research Capacity Enhancement Project (National Research Facilities and Equipment Center) through the Korea Basic Science Institute - Ministry of Education [2019R1A6C1010047]

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In this study, Cu3Sb(1-x-y)Sn(x)BiySe(4) doped with Sn and Bi was synthesized through mechanical alloying and subsequently hot pressing. The doping of Sn and Bi affected the electrical and thermal properties of the material, with Cu3Sb0.92Sn0.06Bi0.02Se4 exhibiting the highest electrical conductivity.
In this study, mechanical alloying was performed to synthesize permingeatite Cu(3)Sb(1-x-y)Sn(x)BiySe(4) (0.02 <= x <= 0.06 and 0.02 <= y <= 0.04) doped with Sn and Bi. Hot pressing was subsequently conducted to achieve dense sintered bodies. When the Bi content was constant, the carrier concentration increased with the Sn content, but the mobility decreased owing to the increased carrier concentration. In contrast, when the Sn content was constant, the carrier concentration and mobility were not significantly affected by the Bi content. Higher electrical conductivity was observed in specimens with a higher Sn content or lower Bi content; consequently, Cu3Sb0.92Sn0.06Bi0.02Se4 exhibited the highest electrical conductivity. The Seebeck coefficient increased with temperature, and it is inferred that the permingeatite doped with Sn/Bi does not undergo an intrinsic transition until 623 K. In contrast to the electrical conductivity, a higher Seebeck coefficient was obtained in the specimens with a lower Sn content or higher Bi content; consequently, Cu3Sb0.94Sn0.02Bi0.04Se4 exhibited the highest Seebeck coefficient. Cu3Sb0.92Sn0.06Bi0.02Se4 exhibited the maximum power factor, depending on the electrical conductivity and Seebeck coefficient. The electronic thermal conductivity was not significantly affected by temperature, but the lattice thermal conductivity decreased as the temperature increased. However, the thermal conductivity decreased with increasing temperature. Sn doping effectively reduced the lattice thermal conductivity, whereas Bi doping effectively reduced the electronic thermal conductivity; consequently, Cu3Sb0.94Sn0.02Bi0.04Se4 exhibited the lowest thermal conductivity. Finally, the highest dimensionless figure-of-merit of 0.75 was achieved at 623 K by Cu3Sb0.92Sn0.06Bi0.02Se4.

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