4.6 Article

Controlled compositional gradients of electroformed gold and silver

期刊

JOURNAL OF APPLIED PHYSICS
卷 132, 期 4, 页码 -

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AIP Publishing
DOI: 10.1063/5.0097466

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资金

  1. U.S. Department of Energy through the Los Alamos National Laboratory
  2. National Nuclear Security Administration of the U.S. Department of Energy [89233218CNA000001]
  3. Dynamic Materials Properties Campaign (C2) under the direction of the DOE-NNSA
  4. U.S. Department of Energy through the Los Alamos National Laboratory
  5. U.S. Department of Energy [89233218CNA000001]
  6. Dynamic Materials Properties Campaign (C2) under the direction of the DOE-NNSA
  7. U.S. Department of Energy(DOE) Office of Science

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Thick (>1 mm) compositionally graded gold/silver (Au/Ag) films were electroformed for high-pressure research, and the role of processing temperature on the nucleation, growth kinetics, and microstructure was investigated. A general framework to fabricate gradients of other materials through electrodeposition was presented.
Motivated by an interest in high-pressure research, thick (> 1 mm) compositionally graded gold/silver (Au/Ag) films were electroformed. Systematic studies were performed to understand the role of processing temperature on the nucleation and growth kinetics and associated microstructure. Furthermore, as the electrolyte composition is continuously changing during the experiment, systematic studies were performed to correlate electrochemical parameters with film morphology and composition. The results showed that the nucleation pathways and relative deposition rate of Au and Ag are heavily dependent on the processing temperature. A procedure to ramp the temperature while continuously pumping an Au electrolyte into an initial Ag electrolyte to produce the graded film is presented. The obtained film is comprised of a segment of pure Au followed by a complete compositional gradient and ending with a segment of pure Ag across 1.5 mm. The results presented here describe a general framework to fabricate gradients of other materials through electrodeposition. Published under an exclusive license by AIP Publishing.

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