期刊
JAPANESE JOURNAL OF APPLIED PHYSICS
卷 61, 期 SJ, 页码 -出版社
IOP Publishing Ltd
DOI: 10.35848/1347-4065/ac7845
关键词
CMP; surface free energy; cleaning process; friction
This study evaluates the phenomena in the interface between a wet PVA sponge and different materials during a chemical mechanical polishing cleaning process. The torques of a rolling wet PVA sponge were measured to determine the effect of surface free energy on the torques between two materials. The results suggest that increasing the rotational speed of a wet PVA sponge decreases some of the torques generated due to hydrogen bonding component interactions.
In order to evaluate the phenomena in a contiguous interface between a wet polyvinyl alcohol (PVA) sponge and various wafers during a chemical mechanical polishing cleaning process, the torques of a rolling wet PVA sponge were measured when it was pressed against various materials. In particular, we sought to determine how the torques between two materials were affected by surface free energy, which is a surface condition parameter consisting of hydrogen bonding component and dispersive component. The results of our investigation suggest that increasing the rotational speed of a wet PVA sponge decreases some of the torques generated due to hydrogen bonding component interactions.
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