4.6 Article

Biot's Variational Method to determine the thermal strain in layered glazings

期刊

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijsolstr.2022.111657

关键词

Glazing; Variational principle; Heat transfer; Transient problem; Thermal strain

资金

  1. Maffeis Engineering SpA, Solagna (Vi), Italy
  2. University of Parma, Italy

向作者/读者索取更多资源

This article presents a solution for the strain issue caused by temperature variations in the structural design of glazed surfaces. The proposed semi-analytical approach, implemented in a finite element code, evaluates the time-dependent temperature profile through the thickness of layered glazing. It rigorously considers energy conservation and is particularly effective for problems with steep temperature variations.
A critical issue in the structural design of glazed surfaces is the evaluation of the strain consequent to temperature variations due to environmental actions such as solar radiation, which represents one of the main causes of breakage. In the practice, approximate solutions are used, where the temperature profile across the glass thickness is constant or linear, but the consequent thermal stress cannot be adequately estimated from these. On the other hand, sophisticated thermal software is available only for important tasks. Here, we propose a semi-analytical approach, easily implementable in a simple FEM code, to evaluate the time-dependent temperature profile through the thickness of layered glazing, which is based on the variational method proposed by Biot in the Fifties. A prompt evaluation not only of the temperature field, but also of the heat flux, can be obtained. Compared to other numerical approaches, this method rigorously accounts for energy conservation and, since it does not involve temperature gradients in the formulation, it is particularly efficient for problems with steep temperature variations. Temperature profiles that are not necessarily linear can be approximated by Hermite-splines, for a precise evaluation of the thermally-induced stress. Comparisons with a direct numerical solution of the heat-conduction differential equations confirm the accuracy and the effectiveness of the proposed approach.

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