4.7 Article

Solving heat conduction problems with a moving heat source in arc welding processes via an overlapping nodes scheme based on the improved element-free Galerkin method

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2022.122940

关键词

Transient heat conduction; Arc welding; Moving heat source; Element-free Galerkin method; Penalty; Overlapping nodes

资金

  1. National Scientific and Technical Research Council (CONICET) of Argentina
  2. European Union H2020 Framework under the LC-EEB-01-2019 call, H2020-NMBP-ST-IND2018-2020/H2020-NMBP-EEB-2019, IA type [870114]
  3. PoroPCM Project (EIG CONCERT-Japan funding)

向作者/读者索取更多资源

This study introduces a novel overlapping nodes scheme within the framework of an improved element-free Galerkin (IEFG) formulation to solve the transient heat conduction problem involving a moving heat source in arc welding processes. The proposed approach utilizes two overlapping arrangements of nodes to transfer temperature and heat flux information and achieve accurate computation of temperature distribution and heat flux.
A novel overlapping nodes scheme developed in the framework of an improved element-free Galerkin (IEFG) formulation is introduced in order to solve the transient heat conduction problem with a moving heat source involved in arc welding processes, in an accurate and remarkably simple manner. The proposed approach consists in solving the aforementioned problem over two overlapping arrangements of nodes, which transfer temperature and heat flux information each other through properly defined immersed boundaries. A fine arragement of nodes (patch nodes) moves with the heat source over a coarse background nodes distribution, and the solution is enriched via an appropriate coupling of the temperature approximations computed over both arrangements. The patch nodes are conceived to achieve an accurate computation of the temperature distribution and corresponding heat fluxes in the heat source vicinity, whose effects cannot be properly captured by the coarse background arrangement. A detailed explanation concerning the appropriate coupling between the temperature fields of both the background and patch nodes, is also provided in this communication. The outcomes of this study reveal that the proposed Overset-IEFG (Ov-IEFG) formulation allows the achievement of very accurate, smooth and stable solutions for both temperature and heat flux fields, without the need of resorting to post-processing or additional local reconstruction techniques. (C) 2022 Elsevier Ltd. All rights reserved.

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