A D-Band Multichannel TX System-in-Package Achieving 84.48 Gb/s With 64-QAM Based on 45-nm CMOS and Low-Cost PCB Technology

A high-data-rate D-band transmitter (TX) module cointegrating a dual-channel TX integrated circuit (IC) in 45-nm CMOS partially deplated silicon-on-insulator (PDSOI) technology and an antenna is presented. The proposed system-in-package is based on an innovative channel-bonding technique and is fabricated using a low-cost printed circuit board process. The IC consists of two upconversion chains, including on-chip millimeter-wave local oscillator generators. The emitted signal is composed of eight channels, each one having 2.16-GHz bandwidth, organized in two sets of four channels at the intermediate frequency (IF) band (around 61.56 GHz) that are upconverted to two adjacent subbands centered at 148 GHz. Then, the two subband signals are combined off-chip using a substrate integrated waveguide diplexer and radiated by a patch antenna array realized on the same package. The output spans from 139.3 to 156.6 GHz. The total equivalent isotropic radiated power is 8.3 dBm. An 84.48-Gb/s data rate is achieved with 64-QAM. The module consumes 600 mW from a 1-V supply and occupies a compact area of 12 x 6 mm(2).

Automated summary

This is a dual-channel transmitter module based on 45nm CMOS partially depleted silicon-on-insulator (PDSOI) technology and an antenna. It achieves high data rate and a wide range of output frequency through innovative channel-bonding technique and low-cost printed circuit board process. The module has low power consumption and compact size.