期刊
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
卷 64, 期 4, 页码 1250-1256出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TEMC.2022.3155471
关键词
Voltage; Integrated circuit modeling; System-on-chip; Large scale integration; SPICE; Switches; Partial discharges; EMC macromodel; ICEM-CE; LECCS-core; operating current; power bounce
This study proposes an EMC macromodel for predicting RF emission and power integrity issues inside an LSI, with compensation of equivalent current sources using correction factors to account for voltage fluctuations in on-chip PDN. This method addresses the issues arising from transient supply voltage fluctuations.
Electro-magnetic compatibility (EMC) macromodels of a large-scale integrated (LSI) circuit core have been proposed to predict conducted RF emission and power integrity issues not only on a printed circuit board but also inside an LSI. They are equivalent circuit models that consist of lumped element impedance blocks of an LSI-core and equivalent current sources expressing internal switching activities. In conventional macromodeling, equivalent current sources have been extracted under ideal power supply conditions, i.e., with constant supply voltage. However, there exists transient supply voltage fluctuations in an actual on-chip power distribution network (PDN), and the operating current and its equivalent current sources are expected to vary with such fluctuations. Such issues with transient supply voltage fluctuations have not been extensively investigated. We propose a method of compensating the equivalent current sources of a macromodel by introducing amplitude and time correction factors, taking into account the voltage fluctuations in an on-chip PDN.
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