期刊
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
卷 22, 期 2, 页码 276-281出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2022.3173000
关键词
GaN on Si; MISHEMTs; power device; in-situ SiN; total ionizing dose; dynamic RON; V-TH shifting; simulation
资金
- Foxconn
- Ministry of Science and Technology (MOST), Taiwan
- Ministry of Education Republic of China (MOE), Taiwan [MOST 110-2634-F-009-027, MOST 110-2622-8-009-018-SB, MOST 110-2622-8A49-008-SB, MOST 109-2222-E-009007-MY2]
This work investigates the effect of Total Ionizing Dose (TID) on the performance of GaN on Si MIS-HEMT power devices with in-situ SiN cap layer. Through experiments and simulations, different mechanisms and their interactions are verified. The characteristics of devices, including V-TH shift, on-resistance (R-ON), and dynamic R-ON, were evaluated.
In this work, the effect of Total Ionizing Dose (TID) on the performance of GaN on Si MIS-HEMT power devices with in-situ SiN cap layer is investigated. 13 samples were exposed to different accumulated dose (100 krad and 400 krad) of Co-60 gamma-ray irradiation with two bias conditions (grounded and stressed). The characteristics of the devices after irradiation experiment were evaluated by measuring V-TH shift, on-resistance (R-ON), and dynamic R-ON. A comprehensive study of TID effects are demonstrated in this article to verify different mechanisms and their interactions. Simulations using PHITs were also carried out to further confirm the damages in the epitaxial structure by the accumulated dose.
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