4.6 Article

Impact of dislocation density on the ferroelectric properties of ScAlN grown by molecular beam epitaxy

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APPLIED PHYSICS LETTERS
卷 121, 期 4, 页码 -

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AIP Publishing
DOI: 10.1063/5.0099913

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  1. Office of Naval Research [N00014-19-1-2225]

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This study reports on the effect of dislocation density on the ferroelectric properties of single-crystalline ScAlN thin films grown by molecular beam epitaxy. Despite the significant difference in dislocation density, ferroelectricity is observed in all three samples. The presence of high dislocation densities results in enhanced asymmetric P-E loops and overestimated remnant polarization values, but decreasing dislocation density improves the leakage current and breakdown strength. Detailed studies suggest that trapping/detrapping assisted transport is the main leakage mechanism in epitaxial ferroelectric ScAlN films.
We report on the effect of dislocation density on the ferroelectric properties of single-crystalline ScAlN thin films grown by molecular beam epitaxy. Wurtzite phase and atomically smooth ScAlN films have been grown on bulk GaN, GaN on sapphire, and GaN on Si substrates with dislocation densities ranging from similar to 10(7) to 10(10) cm(-2). Despite the significant difference in dislocation density, ferroelectricity is observed in all three samples. The presence of high densities of dislocations, however, results in enhanced asymmetric P-E loops and overestimated remnant polarization values. Further measurements show that the leakage current and breakdown strength can be improved with decreasing dislocation density. Detailed studies suggest that trapping/detrapping assisted transport is the main leakage mechanism in epitaxial ferroelectric ScAlN films. This work sheds light on the essential material quality considerations for tuning the ferroelectric property of ScAlN toward integration with mainstream semiconductor platforms, e.g., Si, and paves the way for next-generation electronics, optoelectronics, and piezoelectronics. Published under an exclusive license by AIP Publishing.

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