4.8 Article

3R Electronics: Scalable Fabrication of Resilient, Repairable, and Recyclable Soft-Matter Electronics

期刊

ADVANCED MATERIALS
卷 34, 期 31, 页码 -

出版社

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.202203266

关键词

biphasic liquid metal; electronic waste; recyclable electronics; soft-matter electronics; wearable biomonitoring

资金

  1. Foundation of Science and Technology (FCT) of Portugal through the CMU-Portugal project WoW [45913]
  2. EU structural & investment Funds (FEEI) through operational program of the center region [PTDC/EEIROB/31784/20 17]
  3. European Regional Development Fund, through Portugal 2020 (PT2020) [POCI-01-0247-FEDER-047153]
  4. Competitiveness and Internationalization Operational Programme (COMPETE 2020)

向作者/读者索取更多资源

This article demonstrates a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning is developed. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips are also demonstrated.
E-waste is rapidly turning into another man-made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft-matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high-resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning with an exceptional resolution of <30 mu m in seconds is developed. The phase-shifting property of the BCPs is utilized for vapor-assisted soldering circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat-sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis.

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