4.7 Article

Recent progress of perovskite devices fabricated using thermal evaporation method: Perspective and outlook

期刊

MATERIALS TODAY ADVANCES
卷 14, 期 -, 页码 -

出版社

ELSEVIER
DOI: 10.1016/j.mtadv.2022.100232

关键词

Perovskite; Thermal evaporation; Thermal vacuum evaporation; Perovskite application

资金

  1. National Research Foundation of Korea (NRF) [2020R1A2C2100670]
  2. Korea Agency for Infrastructure Technology Advancement - Ministry of Land, Infrastructure and Transport [22-IFIP-C133622-06]
  3. Ministry of Land, Infrastructure and Transport
  4. National Research Foundation of Korea [2020R1A2C2100670] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)

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Metal halide perovskites have gained significant attention in the semiconductor field due to their simple manufacturing process, high optoelectronic performance, and low cost. This review focuses on the spin-coating method and thermal evaporation method used to fabricate perovskite thin films, as well as the research progress on perovskite devices developed using thermal evaporation.
Metal halide perovskites have been studied in semiconductor fields such as light-emitting diodes (LEDs) and solar cells owing to their simple manufacturing, high optoelectronic performance, and low manufacturing cost. In this regard, spin-coating method facilitates the fabrication of perovskite devices. However, the spin-coating method for perovskite film deposition is difficult to finely control the thickness and form a uniform surface. Thus. the thermal evaporation method was proposed to overcome these shortcomings. This method provides better reproducibility and film quality than the spin-coating method. In this review, the spin-coating method and thermal evaporation method used to manufacture perovskite thin films will be explained. Moreover, the basic principles of perovskite devices (LEDs, solar cells, memory, X-ray detectors) are explained, and research on perovskite devices developed using thermal evaporation is summarized. (c) 2022 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

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