Constructing nickel chain/MXene networks in melamine foam towards phase change materials for thermal energy management and absorption-dominated electromagnetic interference shielding

Phase change materials (PCMs) are ideal for thermal management in miniaturized and integrated electronic devices. However, developing PCMs with efficient thermal management and electromagnetic interference (EMI) shielding has remained a challenge to keep up with the rapid evolution of precision electronics. Herein, melamine foam (MF) was used as a template to build a continuous thermal/conductive network by dip-coating magnetized nickel (Ni)/MXene (NiM), and then, polyethylene glycol (PEG) was encapsulated into porous NiM/MF hybrid sponge via vacuum impregnation method. With the synergistic effect of magnetic Ni chain and highly conductive MXene, the obtained NiM/PCM achieve suitable thermal conductivity (0.39 W/mk), high electrical conductivity (76.3 S/m), and excellent EMI shielding effectiveness (34.6 dB). In addition, the NiM/PCM endows outstanding thermal stability, durability, and high latent heat storage capabilities. This work provides new ideas and insights for the EMI shielding and temperature protection of future microelectronic devices.

Automated summary

Phase change materials (PCMs) are ideal for thermal management in miniaturized and integrated electronic devices. However, developing PCMs with efficient thermal management and electromagnetic interference (EMI) shielding has remained a challenge. In this study, a continuous thermal/conductive network was built on a melamine foam template using magnetized nickel (Ni)/MXene (NiM) through dip-coating, and then polyethylene glycol (PEG) was encapsulated into porous NiM/MF hybrid sponge via vacuum impregnation method. The resulting NiM/PCM exhibited suitable thermal conductivity, high electrical conductivity, excellent EMI shielding effectiveness, as well as outstanding thermal stability and high latent heat storage capabilities.