4.7 Article

Mechanically Tough and Durable Poly(siloxane imide) Network Elastomer for Stretchable Electronic Applications

期刊

ACS APPLIED POLYMER MATERIALS
卷 4, 期 5, 页码 3498-3510

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsapm.2c00102

关键词

polyimide; polydimethylsiloxane; cross-linked polymer network; resistive memory; field-effect transistor

资金

  1. Advanced Research Center for Green Materials Science and Technology from the Featured Area Research Center Program by the Ministry of Education [110L9006]
  2. Ministry of Science and Technology in Taiwan [MOST 1102634-F-002-043]
  3. Ministry of Science and Technology, Taiwan

向作者/读者索取更多资源

A thermally stable and mechanically durable poly(siloxane imide) (PSI) network material was developed, and the performance of the material could be controlled by varying the amount of cross-linker. The material has good solubility and can be used as a substrate material or thin-film active layer to fabricate stretchable and durable electronic devices.
In the development of organic electronics, polyimide ( PI)-based materials have drawn significant research attention due to their remarkable features, including a simple synthesis, solution processability, outstanding thermal stability, and respectable mechanical strength. Despite the good electronic performance of PI-based materials, a high elastic modulus over 1 GPa and a modest elongation at break of the conventional PIs have restricted their applications in stretchable electronics. To address this issue, poly(siloxane imide) (PSI) with a soft siloxane chain has been proposed to achieve a significantly reduced modulus and an increased stretchability. However, previous works revealed the weak mechanical strength of PSI, in which the latest reported stretchable device comprising PSI thin film could only sustain a tensile strain below 40%. Herein, in the present study, we developed a thermally stable and mechanically durable PSI network through the polyaddition-condensation reaction between 4,4'-oxidiphthalic anhydride, aminopropyl-terminated polydimethylsiloxane, and varied amounts of 1,3,5-triaminophenoxybenzene (TAB) as a cross-linker. An optimal PSI network with 11.1% TAB exhibited a high decomposition temperature at 426 degrees C, a softening temperature over 200 degrees C, an elongation at break over 400%, a superior toughness at 13.29 MJ m(-3), and low strain hysteresis. Owing to the improved solubility of PSI, the polymer elastomer can be processed as a substrate material or thin-film active layer with good mechanical properties. Finally, all-solution-processed, stretchable, and durable electronic devices including resistive memory and organic field-effect transistors were fabricated using the designed PSI with an affordable and feasible solution process. This work underlines the importance of network design on soft polymers to create mechanically tough and durable elastomers for next-generation stretchable electronics.

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