期刊
MATERIALS RESEARCH LETTERS
卷 10, 期 7, 页码 488-495出版社
TAYLOR & FRANCIS INC
DOI: 10.1080/21663831.2022.2057201
关键词
In-situ TEM; bending; grain boundary formation; deformation twin; plastic deformation
资金
- Laboratory Directed Research and Development program at Pacific Northwest National Laboratory (PNNL), Solid Phase Processing Science initiative
- U.S. Department of Energy's (DOE's) Office of Biological and Environmental Research and located at PNNL
- DOE [DEAC05-76RL01830]
- U.S. Department of Energy [DE-AC05-76RL01830]
In this work, we investigate the formation of sub-grain boundaries in Cu single crystal during bending using in-situ TEM and finite elemental analysis. The findings reveal that the deformation process involves dislocations propagation, formation of stacking faults and deformation twins, which ultimately leads to the formation of sub-grain boundaries.
In this work, we use in-situ TEM in combination with finite elemental analysis to reveal the sub-grain boundary formation during bending of Cu single crystal. The deformation process is featured by dislocations propagation, formation of stacking faults and deformation twins, and subsequent formation of a sub-grain boundary. Finite element analysis of stress distribution indicates the stacking faults and deformation twins are all initiated from the region that corresponds to the maximum shear stress. The formation of the sub-grain boundary is through the intersection between primary and secondary stacking faults/deformation twins. [GRAPHICS] .
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