Powder-Based Cu3VS4 Photocathode Prepared by Particle-Transfer Method for Water Splitting Using the Whole Range of Visible Light

Powder-based Cu3VS4 photoelectrode with 1.5-1.6 eV of a band gap that was responsive to whole range of visible light was fabricated by a particle transfer method, aiming at enhancement of the photocathodic performance. The particle-transferred Cu3VS4 photoelectrode with a Au-contacting layer (Cu3VS4/Au) showed much higher photocathodic performance for water reduction to produce H-2 under simulated sunlight irradiation (AM-1.5 G) than previously reported Cu3VS4/FTO prepared by a conventional drop-casting method. This drastic enhancement is due to the good contact between photocatalyst particles and the Au-contacting layer of the substrate electrode. Loading of a Pt cocatalyst was effective for further enhancement of the photocathodic performance of the Cu3VS4/Au photoelectrode. Pt(1 nm)-loaded Cu3VS4/Au gave about 4 mA cm(-2) of the cathodic photocurrent at -0.41 V vs NHE at pH7 that was four times higher than that without a Pt cocatalyst under simulated sunlight irradiation (AM-1.5 G). When Cu3VS4 particles with a small particle size were prepared by a flux method, better durability was obtained compared with a solid-state reaction. Efficient photoelectrodes based on a powdered metal sulfide utilizing whole range of visible light have successfully been developed by a particle transfer method, loading of a Pt cocatalyst, and a flux method on photoelectrochemical performance.

Automated summary

A powder-based Cu3VS4 photoelectrode with a band gap of 1.5-1.6 eV that is responsive to the entire range of visible light has been successfully fabricated using a particle transfer method. The photocathodic performance of the Cu3VS4/Au photoelectrode, with a Au-contacting layer, was significantly enhanced compared to previous methods. Loading a Pt cocatalyst further improved the photocathodic performance.