期刊
VACUUM
卷 200, 期 -, 页码 -出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.vacuum.2022.111007
关键词
Cu/W nano-multilayers ; Annealing; Microstructure evolution; Thermal stability
资金
- National Natural Science Foundation of China [51475007, 52074017]
- Beijing Municipal Natural Science Foundation [3202002]
- China-CEEC Joint Education Project for Higher Education [2021113]
The structural evolution of Cu/W nano-multilayers at different temperatures was studied. It was found that the layered structure of the nano-multilayers remained unchanged at lower temperatures but was completely destroyed at higher temperatures. Additionally, the copper grains grew while the tungsten size remained unchanged with increasing temperature.
Copper/Tungsten (Cu/W) nano-multilayers show potential for application as novel low-temperature brazing filler metals. Therefore, researchers are interested in understanding phase stability and microstructural evolution of the nano-multilayers during thermal treatment. A repetition of 50 alternating nanolayers of Cu and W with individual thicknesses of 10 nm were prepared by magnetron-sputtering on silicon substrates. The structural evolution of Cu/W nano-multilayers (NMLs) within the temperature range 400 & DEG;C-800 & DEG;C was monitored using real-time in-situ XRD, SEM, TEM, SAXS, DSC and in-house XRD system. The results showed that the melting point of Cu/W nano-multilayers determined using DSC was 793.694 & DEG;C was remarkably lower than the melting point of bulk Cu(1083 & DEG;C) and W (3140 & DEG;C). After annealing at 400 & DEG;C for 30 min, the surface of the NMLs exhibited more copper grains, with significant coarsening of the copper grains. The layered structure of the Cu/W NMLs was unaffected after annealed at 400 & DEG;C. When annealed at 600 & DEG;C for 30 min, some Cu particles migrated into the W layers along the internal interface leading to cracks which partially collapsed the original stratified structure. The nano-multilayered structure was completely destroyed when annealed at 800 & DEG;C. Further, the in-situ XRD results showed that the copper grains grew substantially, while the tungsten size remained unchanged with increasing temperature.
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