4.8 Article

Volumetric additive manufacturing of silica glass with microscale computed axial lithography

期刊

SCIENCE
卷 376, 期 6590, 页码 308-+

出版社

AMER ASSOC ADVANCEMENT SCIENCE
DOI: 10.1126/science.abm6459

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资金

  1. National Science Foundation [EEC-1160494]
  2. European Research Council (ERC) under the European Union [816006, 825521]
  3. Carl Zeiss Foundation as a part of the Research Cluster Interactive and Programmable Materials (IPROM)
  4. German Research Foundation (Deutsche Forschungsgemeinschaft, DFG) [455798326, Exec 2193/1, 390951807]
  5. Lawrence Livermore National Laboratory Directed Research and Development program
  6. US Department of Energy by Lawrence Livermore National Laboratory [DE-AC52-07NA27344 (LLNL-JRNL-826682)]
  7. European Research Council (ERC) [816006] Funding Source: European Research Council (ERC)

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This article introduces a glass processing method for manufacturing complex microscopic structures. With microscale computed axial lithography, various microfluidic structures, micro-optical elements, and high-strength frameworks with different sizes and shapes can be fabricated.
Glass is increasingly desired as a material for manufacturing complex microscopic geometries, from the micro-optics in compact consumer products to microfluidic systems for chemical synthesis and biological analyses. As the size, geometric, surface roughness, and mechanical strength requirements of glass evolve, conventional processing methods are challenged. We introduce microscale computed axial lithography (micro-CAL) of fused silica components, by tomographically illuminating a photopolymersilica nanocomposite that is then sintered. We fabricated three-dimensional microfluidics with internal diameters of 150 micrometers, free-form micro-optical elements with a surface roughness of 6 nanometers, and complex high-strength trusses and lattice structures with minimum feature sizes of 50 micrometers. As a high-speed, layer-free digital light manufacturing process, micro-CAL can process nanocomposites with high solids content and high geometric freedom, enabling new device structures and applications.

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