期刊
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
卷 144, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.mssp.2022.106570
关键词
Subsurface damage; Polarized laser scattering; Silicon wafer; Grinding; Sensitivity
类别
资金
- National Natural Science Foundation of China [51575084, 52105453]
- China Postdoctoral Science Foundation [2020TQ0149, 2021M691569]
This study presents a novel polarized laser scattering (PLS) method for detecting subsurface damage (SSD) in silicon wafers. The PLS signal is sensitive to the depth of SSD, and a relationship between the PLS signal and SSD depth is established for practical applications of the PLS method.
Silicon is the primary substrate material in the semiconductor industry. Since surface integrity of a silicon wafer is crucial to the performance of an IC chip made of the wafer, the subsurface damage (SSD) induced by machining to a silicon wafer has been intensively investigated. However, detecting SSD is a challenge due to a lack of an effective method. This study presents a novel method, the polarized laser scattering (PLS) method, for detecting SSD in ground silicon wafers. A PLS system is established to detect the grinding-induced SSD which is also evaluated by the destructive methods. The study shows that the PLS signal is sensitive to the SSD depth with a detection resolution of approximately 0.1 mu m. In addition, the detectability of the PLS method is demonstrated and a relationship between the PLS signal and SSD depth is established to facilitate the practical applications of the PLS method.
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