4.2 Article

Preparation and Thermoelectric Properties of Si-Doped Tetrahedrites Cu12Sb4-ySiyS13

期刊

KOREAN JOURNAL OF METALS AND MATERIALS
卷 60, 期 6, 页码 440-447

出版社

KOREAN INST METALS MATERIALS
DOI: 10.3365/KJMM.2022.60.6.440

关键词

thermoelectric; tetrahedrite; mechanical alloying; hot pressing

资金

  1. Basic Science Research Capacity Enhancement Project (National Research Facilities and Equipment Center) through the Korea Basic Science Institute - Ministry of Education [2019R1A6C1010047]

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The Si content in Si-doped Cu12Sb4-ySiyS13 compounds significantly affects their thermoelectric properties, with different trends in the Seebeck coefficient and electrical conductivity as the Si content increases. The solubility limit of Si was determined to be y = 0.3. The highest power factor was achieved at y = 0.2, and the lowest thermal conductivity was observed at y = 0.3.
Si-doped Cu12Sb4-ySiyS13 (y = 0.1-0.4) compounds were prepared using solid-state synthesis. Each specimen consisted of a single tetrahedrite phase with a densely sintered body whose relative density exceeded 98.9%. The lattice constant decreased from 1.0357 nm to 1.0336 nm as the Si content increased. When the Si doping content (y) exceeded 0.3, the decrease in the lattice constant was reduced and residual Si appeared. This established the solubility limit of Si at the Sb sites was y = 0.3. The Seebeck coefficient increased with the temperature and Si content, achieving a maximum value of 178 mu VK(-1 )at 723 K for y = 0.3. For the specimens with y <= 0.2, the electrical conductivity increased with temperature, and then slightly decreased at temperatures higher than 623 K, while it gradually increased with temperature for the specimens with y >= 0.3. The electrical conductivity decreased as the Si content increased at a constant temperature and the highest electrical conductivity of (2.8-3.4) x 10(4) Sm-1 was obtained at 323-723 K for Cu12Sb3.9Si0.1S13. When y = 0.4, the electrical conductivity did not decrease further, which is related to the solubility limit of Si. The power factor reached a maximum value of 0.86 mWm(-1) K-2 at 723 K for Cu12Sb3.9Si0.1S13. As the Si content increased, the thermal conductivity tended to decrease, and Cu12Sb3.7Si0.3S13 exhibited the lowest thermal conductivity of 0.85 Wm(-1 )K(-1) at 723 K. Hence, the highest dimensionless figure of merit, ZT = 0.63 was achieved at 723 K for Cu12Sb3.8Si0.2S13.

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