Rheological behavior of multi-sized SiC inks containing polyelectrolyte complexes specifically for direct ink writing

In order to simultaneously improve both the solid loading and rheological behavior of ceramic ink during direct ink writing (DIW) process, the polyelectrolyte complexes have been used as rheological modifiers. Based on the Funk-Dinger function, the maximum solid loading of multi-sized SiC ink reached 63 vol%. The viscoelasticity of SiC inks with different [COOH]:[NHx] molar ratios was investigated and the mechanism of polyionic chains on rheology was analyzed. When the [COOH]:[NHx] molar ratio was 1:0.1, the SiC ink exhibited excellent thixotropic behavior and formability. The effect of particle size on rheological behavior of SiC ink was investigated to clarify the correlation between polyelectrolyte complexes and multi-sized SiC.

Automated summary

Polyelectrolyte complexes have been used as rheological modifiers to improve the solid loading and rheological behavior of ceramic ink during direct ink writing (DIW) process. The study investigated the viscoelasticity of SiC inks with different [COOH]:[NHx] molar ratios and analyzed the mechanism of polyionic chains on rheology. The effect of particle size on rheological behavior of SiC ink was also explored to understand the correlation between polyelectrolyte complexes and multi-sized SiC.