Experimental studies of necking and fracture limits of boron steel sheet under hot stamping conditions

Boron steel is the most widely used material in hot stamping applications for forming automotive body panels with complex shapes and ultra-high strength. Due to the high austenitic transformation temperatures and the complex thermal cycle required for hot stamping, however, it is difficult to evaluate the formability of the material using standard punch test methods developed for room-temperature testing. In this study, a high temperature modification of a recently developed biaxial test method has been used to determine, in a single test procedure and for the first time, forming limit curves (FLCs) and fracture forming limit curves (FFLCs) for 22MnB5 boron steel sheet with a thickness of 1.5 mm under thermal conditions that are representative of industrial hot stamping processes. A direct resistance heating strategy has been developed, and a recently proposed cruciform specimen design has been modified for high-temperature use. For tests with target temperatures in the range of 750 to 925 degrees C, the resulting test specimens had the highest temperature at the specimen centre and a temperature difference of less than 45 degrees C in the gauge area and fracture occurred close to the centre of this area under all test conditions investigated. Limit strains at the onset of necking and at fracture for the material have been determined by applying digital image correlation (DIC) to obtain full-field strain measurements, providing an experimental foundation for constructing both FLCs and FFLCs for industrial applications.

Automated summary

In this study, a high temperature modification of a recently developed biaxial test method has been used to determine the forming limit curves (FLCs) and fracture forming limit curves (FFLCs) for 22MnB5 boron steel sheet. Full-field strain measurements obtained through digital image correlation (DIC) provide an experimental foundation for constructing these curves in industrial applications.