4.7 Article

High-heat flux Cu-0.8Y alloys investigated by positron annihilation spectroscopy

期刊

JOURNAL OF ALLOYS AND COMPOUNDS
卷 900, 期 -, 页码 -

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2021.163430

关键词

Copper alloys; Oxide dispersion strengthened; Positron annihilation; High-heat flux materials; Equal channel angular pressing; Reinforced materials

资金

  1. Spanish Ministerio de Economia y Competitividad (MINECO) [ENE2015-70300-C3-2-R]
  2. Regional Government of Madrid (Spain) through TECHNOFUSION(III)CM [S2018/EMT-4437]
  3. Comunidad de Madrid (Spain)
  4. Spanish Ministerio de Ciencia e Innovacion through project DAMAINSOL [RTI2018-101020-B-I00]
  5. UC3M (Excelencia para el Profesorado Universitario - EPUC3M14) - Fifth regional research plan 2016-2020

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This study investigates the thermal stability and defect evolution of two high-heat flux Cu-0.8 wt%Y alloys, revealing the formation of stable defect structures above 600 degrees Celsius.
This work studies the thermal stability of the microstructure and the evolution of the defects of two high-heat flux Cu-0.8 wt%Y alloys fabricated following two alternative powder metallurgy routes. One batch was produced by direct hot isostatic pressing (HIP) consolidation of Cu-0.8 wt%Y pre-alloyed atomized powders while an additional ball milling processing step was introduced before HIP sintering for the second alloy. The stability and recovery characteristics of the vacancy type defects in these alloys in the as-produced state and after processing by severe equal channel angular pressing to achieve a refine microstructure have been investigated by positron lifetime and coincidence Doppler broadening measurements in samples subjected to isochronal annealing from room temperature to 900 degrees C. Microhardness measurements and electron transmission microscopy analysis have also been performed to support the results obtained from the positron annihilation spectroscopy analysis techniques. The recovery curves of the positron lifetime and S-W plots show a recovery stage in agreement with the recovery stage V for Cu. However, a full recovery is not accomplished, and a stage that reverts the previous recovery takes place after annealing above similar to 600 degrees C, that leads to the formation of very stable defects at temperatures up to 900 degrees C, identified as vacancy aggregates and nanocavities. The characteristic shape of the coincidence Doppler broadening indicates that the dispersed Y-O particles in the Cu matrix appear to be responsible for stabilizing the vacancy aggregates and nanocavities for temperatures above 600-700 degrees C. (C) 2021 The Author(s). Published by Elsevier B.V.

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