4.7 Article

Electrochemical construction of Cu@NF frameworks and synthesis of self-supported microflower Cu2S@NF as bifunctional catalysts for overall water splitting

期刊

INTERNATIONAL JOURNAL OF HYDROGEN ENERGY
卷 47, 期 35, 页码 15695-15705

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijhydene.2022.03.052

关键词

Copper(I) sulfide; Nickel foam; Electrodeposition; Bifunctional catalyst; Water splitting

资金

  1. National Natural Science Foundation of China [51774044, 51974031, 52022013]

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A two-step electrochemical method is proposed for the in-situ deposition of copper and synthesis of copper(I) sulfide (Cu2S) with controllable morphology on nickel foam (NF), and the resulting Cu2S@NF electrodes exhibit excellent bifunctional electrocatalytic performance. The size and amount of the deposits can be adjusted by controlling applied potentials, leading to the optimization of electrocatalytic activity.
A two-step electrochemical method is proposed for the in-situ deposition of copper and synthesis of copper(I) sulfide (Cu2S) with controllable morphology on nickel foam (NF), and the thus-prepared self-supported Cu2S@NF electrodes exhibit excellent performance as bifunctional electrocatalysts. Characterizations with scanning electron microscopy show rock-shape of the deposited copper through potentiostatic method, which can be further sulfurized to microflower morphology by a unique underpotential electrochemical method. The size and amount of the deposits can be adjusted by controlling applied potentials, leading to the optimization of electrocatalytic activity. The Cu2S@NF exhibits superior electrocatalytic performance towards HER and OER in 1 M KOH with the low overpotentials of 105 mV and 194 mV at 10 mA/cm(2), as well as small Tafel slopes of 92.89 mV/dec and 72.81 mV/dec, respectively. This work provides a simple method for the synthesis of efficient catalysts, which can be extended to the fabrication of other transition metal-based electrocatalysts. (C)& nbsp;2022 Hydrogen Energy Publications LLC. Published by Elsevier Ltd. All rights reserved.

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