4.7 Review

Research progress of the liquid cold plate cooling technology for server electronic chips: A review

期刊

INTERNATIONAL JOURNAL OF ENERGY RESEARCH
卷 46, 期 9, 页码 11574-11595

出版社

WILEY
DOI: 10.1002/er.7979

关键词

heat transfer enhancement; liquid cold plate; microchannel; server electronics chips

资金

  1. Guangdong Basic and Applied Basic Research Foundation [2019A1515111177]
  2. Guangzhou Science and Technology Project [202206010026]
  3. International Cooperation Project of Guangzhou Development District, China [2019GH01]

向作者/读者索取更多资源

This paper reviews the application of liquid cold plates in high-performance server chip heat dissipation and summarizes recent research progress in geometry optimization, interrupted structures, channel patterns, and two-phase flow. Various methods have been applied to increase the heat transfer area and improve thermal performance, but they also result in more pressure drop. Commercialization of liquid cold plates by combining academic research with practical application is crucial. The paper concludes with a discussion on the limitations of current research and future research directions.
A significant quantity of research has been dedicated to the application of liquid cold plates to eliminate the high heat flux in server electronic chips. Traditional parallel straight microchannel liquid cold plates suffer from low heat flux density with uneven flow distribution, which poses a serious challenge to high-performance server chip heat dissipation. This paper reviews recent research progress in geometry optimization, interrupted structures, channel patterns, and two-phase flow of liquid cold plates. The optimal geometry parameters of rectangular cross-sectional microchannels including the aspect ratio, length, and hydraulic diameter are summarized. Inquest of higher thermal performance, various interrupted structures (ribs, pin fins, etc.), special channel patterns (wavy-shaped, zigzag-shaped, fractal, serpentine, and double-layered microchannels, etc.), and two-phase flow on the liquid cold plate are applied to promote fluid-turbulivity and increase heat transfer area, meanwhile they lead to more pressure drop. Furthermore, it is an essential approach to commercialize liquid cold plates by applying the academic and prototype of the liquid cold plate to manufacturing and liquid cooling system solutions. In the end, this review provides a discussion about the limitations of current research on liquid cold plates and an outlook on future research directions.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据