4.6 Article

1.7-kV Vertical GaN-on-GaN Schottky Barrier Diodes With Helium-Implanted Edge Termination

相关参考文献

注意:仅列出部分参考文献,下载原文获取全部文献信息。
Article Nanoscience & Nanotechnology

1.3 kV Vertical GaN-Based Trench MOSFETs on 4-Inch Free Standing GaN Wafer

Wei He et al.

Summary: In this study, a novel vertical GaN-based trench MOSFET device is proposed, and high-quality and stable MOS interface is successfully achieved through a two-step process. The simulation results obtained by Silvaco TCAD are validated by comparing with experimental data. The mechanisms of on-state and breakdown are thoroughly studied, providing optimization guidelines for vertical GaN-based trench MOSFET.

NANOSCALE RESEARCH LETTERS (2022)

Article Engineering, Electrical & Electronic

Current Transport Mechanism of High-Performance Novel GaN MIS Diode

Tao Zhang et al.

Summary: This work presents a high-performance lateral GaN metal-insulator-semiconductor (MIS) diode with a low turn-on voltage of 0.32 V, supported by in-depth theoretical calculations on current transport mechanisms and a forward conduction model. The coexistence of direct tunneling (DT) and thermionic emission (TE) contributes to the low subthreshold swing (SS), while a 1.8 nm thick Al2O3 interlayer effectively suppresses reverse leakage.

IEEE ELECTRON DEVICE LETTERS (2021)

Article Engineering, Electrical & Electronic

High-Voltage and High-ION/IOFF Quasi-Vertical GaN-on-Si Schottky Barrier Diode With Argon-Implanted Termination

Xiaolu Guo et al.

Summary: A high-performance quasi-vertical GaN Schottky barrier diode (SBD) was fabricated successfully with a high-quality n(-)-GaN drift layer and precisely-controlled n-type doping, achieving a high current on/off ratio, low specific on-resistance, and relatively high breakdown voltage. Additionally, with an Argon-implanted termination, a record high breakdown voltage of 405 V was achieved while maintaining good forward conduction characteristics for the GaN-on-Si SBD.

IEEE ELECTRON DEVICE LETTERS (2021)

Article Physics, Applied

Reverse leakage and breakdown mechanisms of vertical GaN-on-Si Schottky barrier diodes with and without implanted termination

Xiaolu Guo et al.

Summary: This Letter investigates the reverse leakage and breakdown mechanisms of vertical GaN-on-Si Schottky barrier diodes with and without argon-implanted termination, revealing the important role of ArIT in reducing leakage and improving breakdown voltage performance.

APPLIED PHYSICS LETTERS (2021)

Article Engineering, Electrical & Electronic

1.4-kV Quasi-Vertical GaN Schottky Barrier Diode With Reverse p-n Junction Termination

Ru Xu et al.

IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY (2020)

Article Chemistry, Physical

Vertical GaN Schottky barrier diodes on Ge-doped free-standing GaN substrates

Hong Gu et al.

JOURNAL OF ALLOYS AND COMPOUNDS (2019)

Review Computer Science, Information Systems

Review of the Recent Progress on GaN-Based Vertical Power Schottky Barrier Diodes (SBDs)

Yue Sun et al.

ELECTRONICS (2019)

Article Engineering, Electrical & Electronic

High-Voltage and High-ION/IOFF Vertical GaN-on-GaN Schottky Barrier Diode With Nitridation-Based Termination

Shaowen Han et al.

IEEE ELECTRON DEVICE LETTERS (2018)

Proceedings Paper Materials Science, Multidisciplinary

Circular Transmission Line Measurement (CTLM) Studies on Epitaxial Layers of AlGaN

P. Arivazhagan et al.

MATERIALS TODAY-PROCEEDINGS (2018)

Article Physics, Applied

1.2 kV GaN Schottky barrier diodes on free-standing GaN wafer using a CMOS-compatible contact material

Xinke Liu et al.

JAPANESE JOURNAL OF APPLIED PHYSICS (2017)

Article Engineering, Electrical & Electronic

GaN-on-Si Vertical Schottky and p-n Diodes

Yuhao Zhang et al.

IEEE ELECTRON DEVICE LETTERS (2014)

Article Engineering, Electrical & Electronic

Planar Nearly Ideal Edge-Termination Technique for GaN Devices

A. Merve Ozbek et al.

IEEE ELECTRON DEVICE LETTERS (2011)

Article Physics, Applied

Helium implanted gallium nitride evidence of gas-filled rod-shaped cavity formation along the c-axis

Jean-Francois Barbot et al.

JOURNAL OF APPLIED PHYSICS (2008)

Article Physics, Applied

Barrier inhomogeneity and electrical properties of Pt/GaN Schottky contacts

Ferdinando Iucolano et al.

JOURNAL OF APPLIED PHYSICS (2007)

Article Physics, Applied

Barrier inhomogeneity and electrical properties of Pt/GaN Schottky contacts

Ferdinando Iucolano et al.

JOURNAL OF APPLIED PHYSICS (2007)

Article Materials Science, Multidisciplinary

Friction in unconforming grain contacts as a mechanism for tensorial stress-strain hysteresis

V. Aleshin et al.

JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS (2007)

Article Crystallography

High-purity GaN epitaxial layers for power devices on low-dislocation-density GaN substrates

S. Hashimoto et al.

JOURNAL OF CRYSTAL GROWTH (2007)

Article Physics, Condensed Matter

Electronic band structure pseudopotential calculation of wurtzite III-nitride materials

B Rezaei et al.

PHYSICA B-CONDENSED MATTER (2006)

Article Physics, Applied

Interaction between dislocations and He-implantation-induced voids in GaN epitaxial layers

D Alquier et al.

APPLIED PHYSICS LETTERS (2005)

Article Engineering, Electrical & Electronic

Carrier mobility model for GaN

TT Mnatsakanov et al.

SOLID-STATE ELECTRONICS (2003)

Article Physics, Applied

Current crowding in GaN/InGaN light emitting diodes on insulating substrates

X Guo et al.

JOURNAL OF APPLIED PHYSICS (2001)

Article Materials Science, Multidisciplinary

Synthesis and Raman scattering of GaN nanorings, nanoribbons and nanowires

ZJ Li et al.

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING (2001)

Article Physics, Applied

High-voltage mesa-structure GaN Schottky rectifiers processed by dry and wet etching

TG Zhu et al.

APPLIED PHYSICS LETTERS (2000)

Article Physics, Applied

Creation of high resistivity GaN by implantation of Ti, O, Fe, or Cr

XA Cao et al.

JOURNAL OF APPLIED PHYSICS (2000)