Radiation Emission Source Localization by Magnetic Near-Field Mapping Along the Surface of a Large-Scale IC With BGA Package

Near-field mapping along the surface of an integrated circuit (IC) could reveal the radiated emission source inside by collecting the radiated electromagnetic field. In this article, the radiated emission source localization is first illustrated in a microstrip line model by analyzing the relationship between the physical position of the line and the hot spots of the electromagnetic field distribution along the line surface. The hot spot in each magnetic field distribution does not necessarily correspond to the physical position of the emission source due to the ground plane below. Furthermore, by analogy with the microstrip line model, the localization analysis is applied to a large-scale IC [field-programmable gate array (FPGA)] in a ball grid array package. For the demonstration, four operation states of the FPGA are designed with four general-purpose input-output (GPIO) pins outputting waveforms of different frequencies. By activating the sources in different operation states, it is found that the activated GPIO pins (as emission sources) can be located well by comprehensively analyzing the emission patterns of different components. The experimental results would be instructive to improve the understanding of IC near-field electromagnetic patterns and reasonable to localize an emission source.

Automated summary

This article investigates the localization of radiated emission sources in integrated circuits (ICs) using near-field mapping technology. By analyzing the relationship between the physical position of the circuit and the distribution of electromagnetic field, the study demonstrates the effective localization of emission sources in microstrip line models and large-scale IC experiments.