4.7 Article

Self-Supporting Ultrathin DLC/Si3N4/SiO2 for Micro-Pressure Sensor

期刊

IEEE SENSORS JOURNAL
卷 22, 期 5, 页码 3937-3944

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/JSEN.2021.3133935

关键词

Diamond like carbon; pressure sensor; piezoresistive; self-supporting film; MEMS

资金

  1. National Natural Science Foundation of China [U20A20296, 51805425]
  2. Ningbo Science and Technology Innovation Project [2020Z023]
  3. K. C. Wong Education Foundation [GJTD-2019-13]

向作者/读者索取更多资源

In this study, a micro-pressure sensor based on DLC/Si3N4/SiO2 films was reported, which demonstrated high sensitivity and stability. The sensor showed minimal sensitivity changes even with dramatic temperature variations. Additionally, the sensor could be compensated using the DLC thermal compensation resistor.
In this study, we firstly reported a micropressure sensor based on self-supporting diamond-like carbon (DLC)/Si3N4/SiO2 films with total thickness of 785 nm, where the DLC film was fabricated by a facile DC magnetron sputtering process. Particularly, the DLC film was selected as a hybrid sensitive and structural material due to its superior mechanical, piezoresistive properties and stability under harsh environment. Results showed that the sensitivity of the integrated sensor could reach 5.3 x 10(-5)/kPa within the pressure range of 0-60 kPa, together with the nonlinearity and the hysteresis was 5.7% FS (full scale) and 0.8% FS, respectively (at 20 degrees C). Most importantly, without any thermal insulation package, the sensitivity only changed slightly within +/- 7.0% even the temperature varied dramatically from -20 degrees C to 100 degrees C. Such excellent performance of the sensor was mainly originated from the good stability of atomic bond structure in DLC films, which was confirmed by the variable-temperature XPS test. In addition, the signal could be further compensated by the DLC thermal compensation resistor in which the temperature coefficient of resistance (TCR) was about -1247.3 ppm/degrees C. These results bring forward a promising strategy to fabricate themicro-pressure sensor with high structural sensitivity, stability as well as lightweight design for micro-electromechanical system (MEMS) used in harsh applications.

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