4.5 Article

Demonstration of the Flip-Chip Bonded Evanescently Coupled III-V-on-Si Sampled Grating DFB Laser

期刊

IEEE PHOTONICS TECHNOLOGY LETTERS
卷 34, 期 8, 页码 444-447

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LPT.2022.3164402

关键词

Silicon; Gratings; Optical waveguides; Lasers; Waveguide lasers; Flip-chip devices; Electrodes; Flip-chip bonded; sampled grating; Si~photonics; III-V on Si laser

资金

  1. Chinses Nation Key Basic Research Special Fund [2017YFA0206401]
  2. Strategic Priority Research Program of the Chinese Academy of Sciences [XDB24010100, XDB24010200, XDB24020100, XDB24030100]

向作者/读者索取更多资源

This article reports a hybrid integrated III-V-on-Si sampled grating distributed feedback laser, which combines an III-V gain chip with a Si-on-insulator photonic integrated circuit by flip-chip bonding. The laser operates at a single wavelength with continuous wave mode and high side mode suppression ratio. It has a low threshold and high output power.
A hybrid integrated III-V-on-Si sampled grating distributed feedback laser by flip-chip bonding an III-V gain chip to Si-on-insulator photonic integrated circuits is reported in this article. Light is evanescently coupled to the Si waveguide with the sampled grating defined for the single-wavelength operation. The laser operates continuous wave with a side mode suppression ratio of more than 30 dB around 1550 nm. The laser threshold is about 65 mA with a maximum output power of 2.0 mW at 25 degrees C.

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