4.6 Article

Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias

期刊

IEEE ELECTRON DEVICE LETTERS
卷 43, 期 6, 页码 934-937

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2022.3168877

关键词

Millimeter-wave m W antenna; 3D glass package; multilayer stack; TGV

资金

  1. National Natural Science Foundation of China [61974121]
  2. Science and Technology Major Project of Xiamen City [3502Z20201004]

向作者/读者索取更多资源

This study proposes a high bandwidth compact linear polarization antenna for the 77 GHz automotive radar millimeter-wave band. It utilizes a five stacked glass layers scheme with high precision metal layers and through glass vias (TGVs) to achieve small size, high-density interconnects, and precise manufacture.
This letter proposes a high bandwidth compact linear polarization antenna for the automotive radar millimeter-wave band of 77 GHz using five stacked glass layers scheme with high precision metal layers and through glass vias (TGVs). The radiation part of antenna is composed of four microstrip patches, wherein a single patch is only 0.55 x 0.55 mm(2), and the overall size of the package is 10 x 9 x 1 mm(3). 6-inch glass wafers with the thickness of 230 mu m or 100 mu m are employed to achieve high-density interconnects and precise manufacture. The interconnects formed by the TGVs and redistribution layer (RDL) realize direct transmission and signal coupling between layers to improve transmission efficiency. The gain is more than 7 dB at frequency of 77 GHz. This proposed glass Antenna shows the superior advantages of process accuracy to realize miniaturization and System in Package (SiP) compared with that of Low-Temperature Co-fired Ceramics (LTCC) and Printed Circuit Board (PCB).

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