期刊
IEEE ELECTRON DEVICE LETTERS
卷 43, 期 6, 页码 838-841出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/LED.2022.3167952
关键词
Ge FinFET; supercritical fluid treatment; plasma post-oxidation; oxidation state; CMOS inverter
资金
- Ministry of Science and Technology, Taiwan [MOST-108-2221-E007-004-MY3]
This study demonstrates that performance improvement on Ge nFinFET, pFinFET, and CMOS inverter can be achieved by using a novel low-temperature damage-free supercritical phase fluid (SCF) treatment. The SCF treatment effectively reduces unstable oxidation states, oxygen vacancies, and interface traps, resulting in higher on-off current ratios, lower S.S., higher on current, and better reliability in Ge FinFETs. Furthermore, the Ge FinFET CMOS inverter shows a higher voltage gain with the SCF treatment.
Performance improvement on Ge nFinFET, pFinFET and CMOS inverter can be achieved by using a novel low temperature damage-free supercritical phase fluid (SCF) treatment. Thanks to effective reduction of unstable oxidation states, oxygen vacancies and interface traps, higher on-off current ratios (8 x 10(5) for pFinFET and 3.3 x 10(5) for nFinFET), lower S.S. (72 mV/dec), higher on current (>45% improvement) and better reliability in Ge FinFETs are achieved with a SCF treatment as compared with a remote plasma post-oxidation (PPO) one. Besides, a higher voltage gain (88 VN) of Ge FinFET CMOS inverter is obtained with a SCF treatment in comparison with a remote PPO one.
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