Electrochemical formation and stability of copper selenide thin films in the choline chloride-urea deep eutectic solvent at gold electrode

The electrodeposition of copper-selenium binary compounds on gold electrode was investigated in the choline chloride - urea (ChCl-U) deep eutectic solvent at 110 degrees C. Cyclic voltammetry and potentiostatic deposition followed by stripping voltammetries were employed to gain thermodynamic insights pointing to the formation of Cu2Se, which is supported by X-Ray Photoelectron Spectroscopy. The electrochemical stability domain of the compound is about 900 mV (from approximate to-0.81 V to approximate to+0.07 V vs. a silver quasi-reference electrode) and is consistent with the thermodynamics of induced co-deposition. The domain is limited at positive potentials by the oxidation to Se(0) and at negative potentials by the reduction to Cu(0). While copper is readily deposited on the gold electrode, the electmdeposition of selenium requires a significant overpotential. As a consequence, copper is kinetically favoured in the co-deposition and is present in its pure form at short deposition times. This is circumvented by using longer deposition times or more negative potentials. Photoelectrochemical measurements show that the as-deposited compound behaves as a p-type semiconductor.

Automated summary

The electrodeposition of copper-selenium binary compounds on a gold electrode is investigated in ChCl-U deep eutectic solvent. The formation of Cu2Se is observed through cyclic voltammetry and potentiostatic deposition followed by stripping voltammetries, and is supported by X-Ray Photoelectron Spectroscopy. The electrochemical stability domain of the compound is limited by the oxidation of Se(0) and reduction of Cu(0). Copper is kinetically favored in the co-deposition process, and requires longer deposition times or more negative potentials to avoid pure copper deposition.