4.7 Article

Highly thermally conductive polymer composite enhanced by two-level adjustable boron nitride network with leaf venation structure

期刊

COMPOSITES SCIENCE AND TECHNOLOGY
卷 222, 期 -, 页码 -

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.compscitech.2022.109406

关键词

Thermal conductivity; Boron nitride; Epoxy resin; Composite materials; Electrical insulation

资金

  1. National Natural Science Foundation of China [52173078, 52130303, 51973158, 51803151, 51973152]
  2. Science Foundation for Distinguished Young Scholars of Tianjin [19JCJQJC61700]
  3. Tianjin Postgraduate Scientific Research Innovation Project [2019YJSB181]

向作者/读者索取更多资源

In this study, a composite material with high thermal conductivity is achieved by constructing a two-level adjustable boron nitride network. The composite exhibits excellent thermal conductivity and electrical insulation, making it promising for applications in thermal management of electronic equipment and thermal interface materials.
Thermally conductive polymer-based composites are extensively used in many fields as thermal control materials. Their thermal conductivity can be effectively improved via the construction of a 3D thermal conduction network. However, multiple 3D networks have low density and lack elasticity and flexibility, leading to suboptimal thermal conductivity. In this study, a composite with high thermal conductivity is obtained by building a two-level adjustable boron nitride (BN) network with leaf venation structure in an epoxy resin matrix, and the density and orientation of the network are controlled by compression. The primary and secondary BN networks construct efficient phonon conduction channels. Moreover, the polydopamine interface between the thermally conductive network and substrate greatly reduces interfacial phonon scattering. The in-plane and cross-plane thermal conductivities of the composite at 35.9 wt% BN loading reach 10.20 and 4.95 W m(-1)K(-1), respectively. And the composite has excellent electrical insulation, all making it promising for the thermal management of electronic equipment and thermal interface material in application prospects, such as the soft robotics, flexible smart devices, and aerospace.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据