Three-dimensional simulation of single-lap and bridge joints of coated conductor under tension and bending tests

As essential components, various types of solder joint structures including single-lap and bridge joints have been developed for the real applications and repair of the superconducting devices. Evaluations of the mechanical properties of these joints are usually performed using the tension (lap-shear) and bending tests. Degradation of critical current and an increase in joint resistance have been observed in these tests. Cracks in the superconducting layer and delamination between the coated conductors may lead to above degraded performance. In order to analyze the above electromechanical behavior of the single-lap and bridge joints, the responses of the single-lap and bridge joints under tension and bending tests are investigated through three-dimensional simulations. It is demonstrated that the numerical models can capture the stress concentration in the superconducting layer at the overlap edge of the joint under tensile tests. Furthermore, the bending radius is found to have a strong impact on the damage level of solder layer, and the damage pattern of the solder layer is related to the joint configurations.

Automated summary

This study investigates the responses of single-lap and bridge joints under tension and bending tests through three-dimensional simulations. The results show that the bending radius has a strong impact on the damage level of the solder layer, and the damage pattern of the solder layer is related to the joint configurations.