Novel hybrid zirconium-silicone resin as high-temperature adhesive and an insight into the thermal resistance mechanism

The development of adhesive materials with excellent heat resistance is urgently to ensure the performance of advanced equipment at extreme environments up to 1500 degrees C. In the present work, a novel hybrid zirconiumsilicone resin (ZAS resin) was synthesized via the addition of zirconium n-propoxide (ZTP) as a structural control component in copolycondensation with alkoxysilanes. Thermal properties revealed that the addition of Zr significantly improved the heat resistance. The residual weight was increased by 168.2%, from initial 31.58 wt% to 84.71 wt%, at 1000 degrees C under Argon atmosphere. A suitable phase diagram showing the structural crystal transformation under high temperature was proposed. The bonding strength of ZAS33 resin increased 296.1% and 92.8% at room temperature and after ablation at 1200 degrees C for 0.5 h, respectively. The underlying mechanisms accounted for the improvements were discussed and correlated to the zirconium content. The resin exhibited extraordinary storage stability at least 6 months, which greatly broadened the application prospects of ZAS resin as high-temperature resistant bonding materials.

Automated summary

In this study, a novel hybrid zirconium-silicone resin with excellent heat resistance was successfully synthesized. The addition of zirconium greatly improved the thermal properties and bonding strength of the resin. Furthermore, the resin exhibited extraordinary storage stability, which greatly broadened its application prospects as a high-temperature resistant bonding material.