4.7 Article

Enhanced thermoelectric perfromance in cubic form of SnSe stabilized through enformatingly alloying AgSbTe2

期刊

ACTA MATERIALIA
卷 227, 期 -, 页码 -

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2022.117681

关键词

Thermoelectric; Cubic SnSe; AgSbTe2; Power factor; Thermal conductivity

资金

  1. National Key Research and Development Program of China [2018YFA070210 0, 2018YFB0703600]
  2. National Postdoctoral Program for Innova-tive Talents [BX20200028]
  3. National Science Fund for Distinguished Young Scholars [51925101]

向作者/读者索取更多资源

This study successfully stabilized the cubic phase of SnSe through alloying and improved its thermoelectric transport properties by introducing Pb. The results showed that the introduction of Pb on the basis of AgSbTe2 alloying effectively reduced the total thermal conductivity while maintaining excellent electrical transport properties.
Metastable cubic SnSe has received extensive attention in terms of theoretical predictions since orthorhombic SnSe was experimentally developed as one of the most promising thermoelectric candidates in recent years. In this work, we successfully stabilized the cubic SnSe through AgSbTe2 alloying, after which the thermoelectric transport properties were significantly optimized by simultaneously suppressing lattice and electronic thermal conductivities via introducing Pb. The maximum power factor of (SnSe)(0.6)(AgSbTe2)(0.4) reached to 13 mu Wcm(-1)K(-2) at 723 K, with a high average power factor of similar to 12 mu Wcm(-1)K(-2) at 300-773 K. Based on 40% AgSbTe2 alloying, the strong phonon-defect scattering and low electronic thermal conductivity caused by Pb alloying contribute greatly to the reduction of total thermal conductivity, while the excellent electrical transport properties were substantially maintained. Finally, the peak ZT value reached to 1.20 and a high average ZT value of similar to 0.90 over 300-773 K were achieved in the cubic phase (SnSe)(0.6)(AgSbTe2)(0.4) with 10% Pb alloyed. (c) 2022 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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