Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming

This paper demonstrates laser forming, localized heating with a laser to induce plastic deformation, can self-fold 2D printed circuit boards (PCBs) into 3D structures with electronic function. There are many methods for self-folding but few are compatible with electronic materials. We use a low-cost commercial laser writer to both cut and fold a commercial flexible PCB. Laser settings are tuned to select between cutting and folding with higher power resulting in cutting and lower power resulting in localized heating for folding into 3D shapes. Since the thin copper traces used in commercial PCBs are highly reflective and difficult to directly fold, two approaches are explored for enabling folding: plating with a nickel/gold coating or using a single, high-power laser exposure to oxidize the surface and improve laser absorption. We characterized the physical effect of the exposure on the sample as well as the fold angle as a function of laser passes and demonstrate the ability to lift weights comparable with circuit packages and passive components. This technique can form complex, multifold structures with integrated electronics; as a demonstrator, we fold a commercial board with a common timing circuit. Laser forming to add a third dimension to printed circuit boards is an important technology to enable the rapid prototyping of complex 3D electronics.

Automated summary

This paper presents a method of laser forming that can self-fold 2D printed circuit boards into 3D structures with electronic function. The laser settings are tuned to achieve cutting or folding, and two approaches are explored to enable folding of commercial PCBs. The technique can create complex, multifold structures with integrated electronics, and has the potential for rapid prototyping of complex 3D electronics.