The effect of submicron-sized initial tungsten powders on microstructure and properties of infiltrated W-25 wt.% Cu alloys

In the present work, several W-25 wt% Cu alloys have been prepared through combined processes of high-energy ball-milling, liquid-phase sintering and infiltration, using the precursors of industrial copper powders with an average particle size of 50 mu m and tungsten powders with alternative average particle size of 8 pun, 800 nm, 600 nm or 400 nm. Microstructure characteristics, relative density, hardness and electrical conductivity of the WCu alloys were investigated to elucidate the effect of initial particle size of tungsten powders. EBSD was further utilized to reveal the orientation and grain size distribution in the WCu alloys prepared by 8 jam and 400 nm-sized tungsten powders. The results showed that the WCu alloy made by 400 nm-sized tungsten powders exhibited excellent homogeneity for both sintered tungsten powders and grains, together with the highest relative density of 98.9%, the highest hardness of 230 HB, and good electrical conductivity of 48.7% IACS. Moreover, it also showed highly improved arc erosion and mechanical wear resistances. (C) 2016 Published by Elsevier Ltd.